Key Takeaways
- Over 2,000 attendees are expected at the 75th IEEE Electronic Components and Technology Conference from May 27-30, 2025 in Dallas, TX.
- The conference will cover 400 technical papers and special sessions on topics like hybrid bonding, photonics, and advanced interconnections.
- A Student and Startup Innovation Challenge is included, showcasing emerging ideas in the electronics packaging industry.
Premier Electronics Packaging Conference Marks 75 Years
The 75th annual IEEE Electronic Components and Technology Conference (ECTC) is set for May 27-30, 2025, at the Gaylord Texan Resort & Convention Center in Dallas, Texas. Anticipating over 2,000 participants, the ECTC serves as a key platform for professionals, researchers, and educators in the field of electronics packaging, components, and microelectronic systems. The conference emphasizes collaboration and knowledge exchange in the industry, and attendees are encouraged to book accommodations soon as limited rooms are available.
As the flagship annual event of the IEEE Electronics Packaging Society, ECTC 2025’s technical program features around 400 technical papers presented in 36 oral and five interactive sessions, alongside a dedicated student session. In addition, there will be 12 special sessions addressing pivotal topics and over 135 exhibits from leading companies globally, providing ample networking opportunities.
Among the core topics at this year’s conference are heterogeneous integration, photonics, advanced packaging technologies, reliability, interconnect design, and 2.5D/3D integration methods. Przemyslaw Gromala, the ECTC 2025 Program Chair, underscored the growing significance of packaging technology in the semiconductor sector, citing that the advancements in heterogeneous integration now often yield greater benefits than merely increasing chip speeds per Moore’s Law.
Highlighting the agenda is the Plenary Keynote Talk by Samuel Naffziger from AMD on “Achieving Efficient Zettascale Compute in the AI Era,” where he will explore the rising demand for computational power and the innovations required to meet that demand efficiently. This session will discuss groundbreaking technologies for maximizing computing within integrated systems while maintaining power efficiency.
Additionally, the conference will host various special sessions featuring industry experts who will delve into subjects such as ultra-high-density interconnect technologies, hybrid bonding challenges, and advanced materials for packaging integration. Among these discussions will be the impact of chiplets on fault isolation and the future of quantum photonic packaging.
A unique aspect of ECTC 2025 is the Student and Startup Innovation Challenge, where participants pitch cutting-edge ideas to a panel of jurors, fostering innovation and entrepreneurship in the electronics sector. Attendees can also engage in a Heterogeneous Integration Roadmap workshop and explore professional development courses urging participants to deepen their expertise in electronic packaging and design.
The ECTC marks its significant 75th anniversary this year, evolving from its origins as the Symposium on Improved Quality Electronic Components initiated in 1950. Over the decades, the conference has adapted to new technologies and industry needs, making it an essential gathering for advancing microelectronics. The celebratory ECTC Reception Gala on May 29 will commemorate this milestone.
For more information on registration and the conference schedule, visit the official ECTC website.
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