Key Takeaways
- The SEMI 3D & Systems Summit will be held from June 25-27, 2025, in Dresden, focusing on innovations in heterogeneous integration.
- Sessions will cover topics including geopolitical dynamics, chiplet applications, and hybrid bonding technologies.
- Networking opportunities are available for participants to explore business partnerships and attend a reception and dinner.
The SEMI 3D & Systems Summit is set to take place in Dresden, Germany, from June 25-27, 2025. This year’s theme is “Heterogeneous Integration: Bolstering Europe’s Resilience,” emphasizing advances in semiconductor manufacturing and the significance of chiplet technology. Registration for the event is currently open.
Laith Altimime, President of SEMI Europe, expressed enthusiasm for the Summit, highlighting its role as a platform for industry leaders to collaborate and share innovations that will shape the future of semiconductors. The event will explore critical topics that support Europe’s semiconductor industry amid increasing global competition.
**Panels and Sessions**
The Summit will feature a series of sessions aimed at addressing pressing industry challenges and advancements:
– **NextGen Talent: Empowering Careers, Driving Growth**: This session features speakers from various sectors discussing best practices for talent acquisition and retention—a crucial factor for sustaining Europe’s leadership in the semiconductor industry.
– **Geopolitical Dynamics and Market Trends**: Experts will analyze how current geopolitical issues are influencing the semiconductor landscape, focusing on Europe’s strategic positioning amid global supply chain complexities.
– **Chiplet Applications: System Level Architectures**: Participants will gain insights into the application and design aspects of chiplet technology, exploring system-level architectures.
– **Hybrid Bonding – Die to Wafer**: This session will delve into die-to-wafer hybrid bonding, discussing its significance for advanced 3D integration and its potential scalability and cost-effectiveness.
– **Hybrid Bonding – Wafer to Wafer**: Experts will review wave-to-wafer bonding technologies, addressing their current status, challenges, and market opportunities.
– **Photonics and Co-Package Optics**: Industry leaders will share information on integrating photonics with co-package optics, which could drive efficiencies and innovations across various sectors.
– **European Readiness: Design, Materials, Manufacturing**: Visionaries will present on design, materials, and scalability, emphasizing challenges and innovative solutions for advancing 3D integrated circuits and chiplet production.
**Networking Opportunities**
The Summit will also offer a platform for business networking and matchmaking, allowing participants to form new partnerships and explore business opportunities. A networking reception will occur at the Hilton Dresden on the first day, followed by an annual dinner cruise on the Elbe River, exclusive to event participants.
Numerous global leaders in the semiconductor field are confirmed to present at the Summit, including companies like Intel, Bosch, and ASML, among others. For those interested in exhibiting, contact details are available to reserve space.
**About SEMI**
SEMI is a global industry association representing over 3,000 companies within the semiconductor and electronics sectors. The organization advocates for members by addressing industry challenges and fostering collaboration to propel innovation in design, manufacturing, and supply chain management.
For more information and to stay updated, visit the official SEMI website and engage with SEMI Europe on social platforms.
The content above is a summary. For more details, see the source article.
