Key Takeaways

• The InPlay IN120 NanoBeacon Wireless Sensor SoC received the Best of Sensors award in the IoT & Connectivity Solution category.
• This ultra-low-power Bluetooth Low Energy chip solves challenges in wireless temperature monitoring at scale.
• Its compact design allows integration into labels and packaging, expanding IoT connectivity possibilities.

Award Recognition

InPlay’s IN120 NanoBeacon Wireless Sensor System-on-Chip (SoC) was honored with a Best of Sensors award in the IoT & Connectivity Solution category during the Sensors Converge event held on May 6, 2026, in Santa Clara, California. These awards celebrate innovative technologies in the fields of sensors, electronics, and embedded systems, with decisions made by a panel of professional judges based on factors like innovation, market value, and the capacity to address significant challenges in the sensor ecosystem. This marks the 41st Sensors Converge event, organized under the Questex umbrella.

Innovative Temperature Monitoring

The InPlay IN120 NanoBeacon is designed as an ultra-low-power Bluetooth Low Energy (BLE) SoC specifically for high-volume, battery-powered wireless sensing applications. It places a notable emphasis on temperature monitoring across various Internet of Things (IoT) applications, such as food logistics. There is an increasing demand for chip-level solutions that manage temperature monitoring efficiently and at scale.

Previously, temperature sensing solutions faced significant hurdles; standalone temperature data loggers, while accurate, were too bulky and costly. Traditional BLE sensors often required multiple integrated circuits (ICs), firmware, and larger batteries. Additionally, RFID temperature tags fell short on continuous sensing capabilities and real-time visibility, complicating their adoption.

The InPlay NanoBeacon addresses these limitations by incorporating a factory-calibrated, high-accuracy temperature sensor (±1°C) directly within the wireless SoC. This innovative design negates the need for external sensor ICs, microcontrollers (MCUs), or additional firmware, resulting in a compact configuration. The product is packaged as a Bumped Known-Good-Die (KGD) that measures just 1.6 mm × 1.6 mm × 0.15 mm, claiming to be the smallest Bluetooth Low Energy wireless sensor SoC globally. This small form factor allows for the embedding of sensing and connectivity directly into labels, packaging, and other space-constrained items, unlocking new possibilities for IoT connectivity and temperature measurement.

For those interested in the full list of 2026 award recipients, it is available online.

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