Edgewater Wireless Secures Federal Grant to Advance Wi-Fi Chip Commercialization

Key Takeaways

  • Edgewater Wireless Systems receives $921,000 in funding from FABrIC to expedite its multi-link Wi-Fi silicon platform development.
  • The funding is part of Canada’s initiative to bolster its semiconductor industry and enhance economic resilience.
  • The $2.4 million project aims to address limitations in high-density wireless environments across various sectors by December 2026.

Funding Acceleration for Advanced Wi-Fi Technology

Edgewater Wireless Systems, a leader in Wi-Fi Spectrum Slicing technology, has secured $921,000 in non-dilutive funding from FABrIC, Canada’s initiative to advance semiconductor and sensor solutions. This investment will accelerate Edgewater’s $2.4 million initiative aimed at enhancing its next-generation multi-link Wi-Fi silicon platform. The technology is set to revolutionize high-density and interference-sensitive wireless environments in sectors such as residential, enterprise, and industrial Internet of Things (IoT).

Andrew Skafel, president and CEO of Edgewater Wireless, emphasized the importance of semiconductor innovation in the current geopolitical climate, stating that this funding underscores Canada’s commitment to strengthen its position in global technology. He noted that this initiative will not only hasten their product development but also lead to job creation and increased shareholder value, ultimately benefiting Canada’s economic resilience.

Lynn McNeil, vice president of FABrIC, explained that semiconductors are essential to daily life, powering sectors from healthcare to advanced AI, highlighting the importance of developing a robust semiconductor supply chain. She pointed out Canada’s unique capabilities in areas like photonics and quantum technologies, which can be leveraged to create a diverse and thriving semiconductor ecosystem.

The FABrIC initiative focuses on enhancing Edgewater’s next-gen Wi-Fi baseband technology to tackle existing performance limitations in vital deployments for residential, enterprise, and IoT applications. The project is anticipated to achieve Technology Readiness Level (TRL) 6+ by December 2026, supporting Canada’s goal of building local expertise in advanced semiconductor design and production.

FABrIC is designed to facilitate Canadian companies in the semiconductor manufacturing and internet-connected product sectors, ultimately enabling them to compete in global markets. The initiative places emphasis on four primary technologies: quantum, photonics, compound semiconductors, and MEMS, providing focused funding for both manufacturing processes and product innovations.

By integrating the semiconductor sector with various Canadian industries—including automotive, mining, agriculture, and defence—FABrIC aims to enhance innovation and competitiveness amidst evolving global trade dynamics. Launched in 2024, FABrIC is backed by a five-year funding plan of $223 million dedicated to developing the national semiconductor ecosystem. Through collaboration among industry stakeholders, non-profits, educational institutions, and government entities, FABrIC is set to boost commercial viability and amplify Canada’s advantages in the semiconductor industry.

As a member of FABrIC, Edgewater Wireless is at the forefront of this initiative, committed to transforming challenges in global communications and connectivity into competitive strengths. Interested partners and industry peers are encouraged to explore how Spectrum Slicing is addressing the complexities of high-density wireless environments.

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