Key Takeaways

• EMASS has successfully transitioned its 16nm ECS-DoT SoC into fabrication at TSMC, enhancing ultra-low-power edge AI technology.
• The new 16nm SoC increases integration and performance while maintaining compatibility with existing 22nm designs.
• Key features include a fully integrated BLE subsystem, expanded on-chip memory, and a dedicated object-detection accelerator for improved AI workflows.

Next-Generation Ultra-Low-Power Technology

EMASS, a subsidiary of Nanoveu focused on semiconductor technology, has announced the tape-out of its 16nm ECS-DoT system-on-chip (SoC), which has moved into fabrication at TSMC. This marks a critical step in the development of ultra-low-power edge AI architecture. The 16nm ECS-DoT builds upon the success of the existing 22nm ECS-DoT platform, offering increased compute density, memory bandwidth, and system integration while adhering to ultra-low-power principles.

With a shift to 16nm, the ECS-DoT design allows for higher logic density and improved subsystem integration, enabling it to handle more complex always-on applications while maintaining power efficiency. Currently, the 22nm ECS-DoT platform is actively integrated into various customer products, including wearables, industrial sensors, and smart infrastructure. The established market presence of the 22nm version provides a solid base for the new 16nm variant, allowing for performance enhancements without requiring changes to existing software workflows.

This advanced SoC features integrated components such as wireless connectivity, dedicated AI accelerators, and fine-grained power management. These elements are compactly designed within a single chip, decreasing reliance on external components and ensuring low-latency functionality in battery-operated devices.

Mark Goranson, CEO of EMASS, remarked that the tape-out signifies a successful scaling of the company’s ultra-low-power edge AI technology. He emphasized that the 16nm ECS-DoT is not merely a smaller device but proof that always-on intelligence can expand into more demanding applications effectively and efficiently.

The 16nm SoC enhances overall system capabilities while minimizing the need for external components. Notable features of this new architecture include:

– A fully integrated Bluetooth Low Energy (BLE) subsystem that simplifies design and reduces costs.
– Increased on-chip memory for accommodating larger AI models and boosting throughput while reducing the need for off-chip memory access.
– An adaptive power management architecture that improves energy efficiency for a range of applications.
– A dedicated object-detection accelerator that optimizes performance for visual processing tasks.
– An integrated floating-point unit that enhances efficiency for digital signal processing and AI workflows.

Crucially, the ECS-DoT architecture ensures full software compatibility across different generations, allowing developers to transition applications between the 22nm and 16nm platforms with minimal adjustments. This continuity enables easier scaling of functionality and intelligence, streamlining the development of next-generation edge products.

The successful tape-out of the ECS-DoT reflects EMASS’s “Atoms-to-Apps” development philosophy, wherein application needs are synchronized with algorithm design and silicon implementation. Dr. Mohamed Sabry, founder and CTO of EMASS, noted that this milestone validates the company’s architectural decisions and positions it well to support a broader scope of always-on edge AI applications while prioritizing energy efficiency.

EMASS, as part of Nanoveu, specializes in advanced semiconductor solutions that provide efficient on-device AI for various applications, from industrial IoT to wearables. The partnership aims to enhance innovation in the rapidly evolving fields of AI and edge computing, ensuring their offerings meet the growing demand for intelligent devices.

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