Onsemi Unveils Advanced Cooling Package for Power MOSFETs to Enhance EV Efficiency

Key Takeaways

onsemi launches EliteSiC MOSFETs in T2PAK packaging, enhancing thermal performance for EVs and energy systems.
The design minimizes thermal resistance, enabling lower operating temperatures and improved system efficiency.
Benefits include extended lifespan and faster time to market for next-generation automotive technologies.

Innovative MOSFETs for Enhanced Performance

onsemi has introduced its EliteSiC metal-oxide semiconductor field-effect transistors (MOSFETs) in the industry-standard T2PAK top-cool package, which aims to improve thermal performance and design flexibility in electric vehicles (EVs), solar infrastructure, and energy storage systems. This new product line effectively integrates onsemi’s advanced silicon carbide technology with the innovative T2PAK packaging.

The initial product offerings include 650-volt and 950-volt EliteSiC MOSFETs housed in T2PAK packaging. These devices are engineered for optimal thermal efficiency, directing heat away from printed circuit boards and into the system’s heatsink, thus overcoming thermal limitations. This approach contributes to superior thermal performance, higher power density, compact system design, and reduced operational temperatures—all crucial elements for engineers tasked with developing advanced EV powertrains, on-board chargers, and high-density inverters.

The T2PAK top-cool package is particularly designed to closely couple the MOSFET with the application’s heatsink, minimizing junction-to-heatsink thermal resistance. The initial selection of products offers Rds(on) options ranging from 12 milliohms to 60 milliohms, providing flexibility for power electronics design. Additionally, this packaging method maintains low stray inductance, which supports fast switching frequencies and minimizes energy loss, further improving efficiency.

For electric vehicle applications, onsemi underscores various benefits including a longer system lifespan stemming from reduced component stress, a streamlined design process that accelerates time to market, and enhanced performance capabilities for high-density systems.

Auggie Djekic, Vice President and Head of SiC Division at onsemi, commented on the importance of thermal management in power systems design, particularly within automotive and industrial applications. “Thermal management is one of the most critical challenges facing power systems designers today,” he said. Djekic further emphasized that the combination of the EliteSiC technology with the T2PAK top-cool package enables customers to realize superior thermal performance and design flexibility, empowering them to create innovative products that stand out in a competitive market.

The launch of these cutting-edge MOSFETs positions onsemi as a pivotal player in the power electronics landscape, catering to an increasing demand for thermal efficiency and robust performance in next-generation technologies.

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