Key Takeaways
- The Advanced Packaging International Conference will take place from April 20 to 22 in Brussels, featuring over 40 expert presentations.
- Robert Patti from NHanced Semiconductors will discuss “Foundry 2.0,” highlighting a new approach to semiconductor innovation that transcends traditional scaling.
- The conference aims to enhance understanding of advanced packaging technologies to improve semiconductor efficiency and reduce costs.
Conference Overview
The inaugural Advanced Packaging International Conference will be hosted in Brussels, Belgium, from April 20 to 22, 2026. This significant event will feature more than 40 presentations from leading industry professionals and academics, focusing on advanced packaging and its role in semiconductor innovation. Keynote speaker Robert Patti, president of NHanced Semiconductors, is set to address the shift toward a new model in semiconductor manufacturing titled “Foundry 2.0.”
The conference will include a series of expert-led talks, panel discussions, a poster session, and extensive networking opportunities. These elements aim to provide attendees with in-depth insights into how advancements in packaging technology can unlock new capabilities for semiconductor systems.
Patti emphasizes a pivotal change in semiconductor production, reflecting on how traditional methods have reached a critical juncture. He notes that the industry has relied on shrinking transistor sizes for the last five decades, a model that has increasingly become costly and time-consuming. Advanced packaging offers an innovative pathway that does not depend solely on this scaling method.
Patti’s presentation will outline the key attributes of Foundry 2.0, which represents a cohesive integration of advanced packaging techniques and material solutions. This new approach uses the same interconnect methodologies and manufacturing processes typically employed in semiconductor device construction. According to Patti, the future of semiconductors will hinge on advanced packaging, additive silicon manufacturing, and heterogeneous integration—all aimed at achieving better returns on investment, reducing developmental costs, and lowering capital expenditures.
About NHanced Semiconductors
NHanced Semiconductors, headquartered in Illinois, is recognized as the world’s first pure-play advanced packaging foundry. The company specializes in cutting-edge Back-End of Line (BEoL) semiconductor technologies, covering a wide range of capabilities such as chiplets, 3D integrated circuits, silicon interposers, 2.5D hybrid bonding, and more. Their facilities enable in-house process development and customer prototyping, thereby bolstering their innovative offerings within the semiconductor industry.
Advanced Packaging International Conference 2026
The Advanced Packaging International Conference is part of AngelTech, which encompasses a series of events focused on chip-level technologies. With over 800 delegates expected, along with 80+ exhibitors and 120+ presentations, the conference aims to be a leading global platform for discussing compound semiconductors, photonic integrated circuits, power electronics, and more. This convergence will allow attendees and exhibitors to engage with the entire relevant supply chain and associated stakeholders.
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