Key Takeaways

• The shift to 800V+ SiC inverters creates challenges for DC-link capacitors with traditional dielectric films.
• Peak Nano’s NanoPlex™ LDF film is designed to meet these high-temperature dielectric needs without requiring significant redesigns.
• A comprehensive testing program is underway to further validate the performance of NanoPlex LDF in real-world applications.

NanoPlex™ LDF and the Power Ring Platform: Addressing Industry Challenges

The rise of 800V+ SiC inverters is presenting new demands on DC-link capacitors, calling into question the capabilities of conventional dielectric films. Advanced Conversion has been addressing these issues through its Power Ring platform, which leverages patented high-temperature PEN HV polymer dielectric film. However, the industry now confronts a supply gap as the sole manufacturer of this high-temperature film has exited the market.

To tackle this challenge, Peak Nano has introduced its NanoPlex™ LDF film, a domestically produced, high-temperature dielectric film specifically engineered to handle the rigorous thermal, voltage, and dV/dt requirements associated with SiC applications. A forthcoming webinar aims to delve deeper into the dielectric properties relevant for 800V+ systems, comparing NanoPlex LDF’s performance against established benchmarks. Additionally, it will explore its compatibility with the Power Ring architecture, highlighting that integration can occur without necessitating a redesign of surrounding systems.

The session will address several critical areas, including:
– Specific dielectric requirements essential for DC-link applications over 800V SiC
– Material properties and performance capabilities of NanoPlex LDF
– Current status of characterization and testing related to this film
– Implications for domestic supply chains in multi-year inverter programs
– Open technical questions that remain and the roadmap for further testing

This initiative represents a crucial step in ensuring that the electric vehicle and renewable energy sectors can continue to innovate and grow without reliance on outdated materials or compromised supply chains. A comprehensive characterization program funded by Peak entails ongoing testing, with future performance claims contingent upon robust data validation.

The upcoming webinar is scheduled for Wednesday, June 17, 2026, at 11:00 AM EDT, and registration is free, providing an accessible opportunity for industry stakeholders to gain insights into these advancements and the future of high-temperature dielectrics in power electronics.

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