Key Takeaways
- Hyundai Mobis has achieved the highest ISO 26262 certification for its semiconductor R&D process.
- The certification ensures all semiconductors developed under Hyundai Mobis’s procedures meet robust safety standards.
- The company plans to enhance the domestic automotive semiconductor ecosystem through partnerships and new R&D initiatives.
Major Certification Achievement
Hyundai Mobis has announced that it has received the highest ISO 26262 certification, which pertains to an international functional safety standard for road vehicles. This certification, issued by exida, a German agency focusing on automotive safety and cybersecurity, covers the full scope of Hyundai Mobis’s semiconductor research and development (R&D) process.
This significant accomplishment indicates that every semiconductor produced by Hyundai Mobis, under its standardized R&D procedures, is recognized for its reliability. While typical certifications focus on individual components like microcontrollers, this achievement highlights the rigorous evaluation of the entire R&D platform by assessing risk management and safety awareness among researchers.
In addition to the ISO 26262 certification, Hyundai Mobis has achieved the highest Automotive Safety Integrity Level, indicating that its components are nearly 100 percent effective in preventing dangerous malfunctions, such as brake failures.
Following the acquisition of Hyundai Autron in 2021, Hyundai Mobis commenced mass production of its own semiconductors this year. This production is set to include at least 20 million units of 16 different types of semiconductors.
To further its innovations, Hyundai Mobis is collaborating with foundries to develop 11 next-generation semiconductor technologies, which will include solutions for battery management systems and integrated chips over the next three years.
Hyundai Mobis aims to expand the domestic automotive semiconductor ecosystem by sharing its expertise with major partners. Initiatives in this effort include establishing a joint lab with Global Technologies and successfully developing an integrated drive semiconductor with Dongwoon Anatech. The company plans to collaborate with design houses and research institutions to strengthen this ecosystem.
Lee Hee-hyun, vice president of Hyundai Mobis’s System Semiconductor R&D Group, emphasized the intention to foster an R&D environment that prioritizes functional safety through enhanced partnerships both domestically and internationally while also focusing on internalizing technology.
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