Semiconductor Breakthrough Achieves 99% Yield in Panel-Level Packaging Production

Key Takeaways

Nordson’s ASYMTEK Vantage® system improves underfill yields to over 99% for semiconductor manufacturing.
The IntelliJet® Jetting system reduces cycle times by nearly 30% while enhancing fluid flow and warpage mitigation.
Powertech Technology, Inc. (PTI) collaborates with Nordson to advance panel-level packaging to meet increasing semiconductor demands for AI and HPC applications.

Advancements in Semiconductor Manufacturing

Nordson Electronics Solutions has launched innovative strategies in panel-level packaging (PLP) for semiconductor manufacturing, notably through its ASYMTEK Vantage® dispensing system. This system, equipped with the IntelliJet® Jetting technology, has enabled Powertech Technology, Inc. (PTI) to achieve underfill yields exceeding 99% as PTI transitions from traditional wafers to panels.

Nordson’s collaboration with PTI has resulted in enhanced manufacturing capabilities that cater to the increasing complexities of semiconductor designs, especially for AI and high-performance computing (HPC) applications. By facilitating the transition from 300-mm wafers to panels, PLP manages larger die sizes and higher-density designs efficiently and cost-effectively.

The ASYMTEK Vantage® system ensures high-quality, void-free underfill outcomes at scale. The partnership with PTI included a comprehensive PLP demonstration, where Nordson’s advanced technology significantly improved fluid flow and minimized warpage, achieving a cycle time reduction of almost 30%. These advancements are crucial, given the rising demands from applications that rely on high-performance CPUs and GPUs, which are essential for modern computing architectures such as flip-chip and 2.5D/3D ICs.

Underfill processes have continually evolved since their introduction with flip-chips in the 1990s, growing increasingly vital for mechanical reliability and thermal performance in semiconductor packaging. Nordson has been at the forefront of these innovations, adapting its solutions as the industry progresses from PC boards to panel applications.

Support for these developments was also provided by Jetinn Global Equipment Ltd., Nordson’s distributor, which invested in demonstration equipment and offered expert technical assistance throughout the project.

Nordson Electronics Solutions continues to exemplify commitment to advancing reliable electronics through its brands, including ASYMTEK, MARCH, and SELECT. The company has over 40 years of experience supplying the semiconductor industry with innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions to enhance product reliability.

With operations across 35 countries, Nordson Corporation is well-positioned as a leader in precision technology, focusing on scalable growth and dedicated service to its global clientele across various market sectors.

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