Key Takeaways
- Jeffery Gao has been appointed chairman of HiSilicon, replacing Eric Xu.
- This change occurs amid consolidation in China’s semiconductor industry amid the US-China tech conflict.
- The reasons for the leadership change remain unclear, with no immediate comment from Huawei.
Leadership Changes at HiSilicon
Huawei Technologies has undergone a leadership transition in its chip design unit, HiSilicon, amid a broader consolidation in China’s semiconductor sector influenced by the ongoing US-China tech war. Jeffery Gao has been promoted from his role as head of the Shanghai division to chairman of HiSilicon, taking over from Eric Xu, who has led the chip unit since 2008.
Gao holds a degree in telecommunications engineering from Southeast University in Nanjing and has been with Huawei since 2012. He previously managed the company’s transmission and router product lines and became the general manager of HiSilicon’s optoelectronics department in 2019. In addition to his new position as chairman, Gao also assumes the role of legal representative of HiSilicon, as noted by the Chinese corporate data provider Tianyancha.
The latest changes raise questions regarding their association with Huawei’s rotating chairman system or potential shifts within HiSilicon’s business framework. Eric Xu, who has held the position of Huawei’s rotating chairman since April 1, is expected to remain in this role until September 30.
While this leadership adjustment reflects internal changes within Huawei, the absence of comments from the company leaves speculations surrounding the motivations behind the reshuffle. As the semiconductor industry faces mounting pressures due to geopolitical tensions, such changes can have significant implications for the direction of HiSilicon and its competitive position in the market.
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